Thin-Plate Friendly Semiconductor Hybrid Welding Machine with Reduced Burn-Through

The Hanwei semiconductor hybrid welding machine leverages the characteristic of semiconductor lasers that enable higher energy absorption on the surface of metal materials, allowing for the rapid formation of a stable molten pool at the initial stage of welding. Compared with traditional single laser welding methods, it effectively mitigates energy fluctuations caused by highly reflective materials, resulting in a smoother welding process and significantly improved weld continuity and consistency.

• High energy absorption rate and stable, controllable welding process
• Ideal for thin plate welding with significantly reduced burn-through risk
• Minimal welding spatter and reduced post-processing costs
• High compatibility with automated production lines and suitability for large-scale production

The machine’s robust molten pool control capability significantly minimizes spatter during welding, ensuring a cleaner weld surface. This feature effectively reduces subsequent secondary processing procedures such as grinding and cleaning, shortens the overall production cycle, and helps customers lower comprehensive manufacturing costs.

The equipment supports seamless integration with industrial robots, automatic feeding systems and online inspection devices, facilitating integration into automated and intelligent production lines. It is suitable for large-scale continuous production of power batteries, electronic control components and precision metal parts, providing reliable support for enterprises to achieve high-efficiency and standardized manufacturing.